microelectronics
Product Product Features Product Image
Hybrid Technology
  • Flexible in design
  • Excellent electrical characteristics
  • Increased reliability and performance
  • Long term stability
  • Advantages in volume, size and weight and a high degree of miniaturization
  • Fine-line conductors and spaces, with tight tolerances
  • Short signal paths
  • Combination of digital - and analogous elements
  • ASIC’s can be incorporated as dies
  • Effective thermal management
  • Protection against mechanical damage and aggressive environment
  • Technology of choice for the RF range
  • Outstanding EMV-properties
Thin Film & Thick Film Development , Design and Manufacture hybrid-modules in thin film technology according to customer requirements and specifications. Resistor-chips with bond pads 30x30 mils in the range of 0,1 Ohms – 10 MOhms can be realized. Front and back side coating and through holes are possible.
Packaging Hermetically sealed metal packages. Hermetical sealing followed by leakage testing in accordance with MIL 883E, meth. 1014.
  • Seam Welding
  • Resistance Welding (capacitor powered equipment)
  • Resistance Welding with Glovebox
Obsolence Support Circuit Development
  • Department for circuit development, specialized on analog circuitry
  • RF & Microwave, high voltage, low noise and precision circuitry
  • Reverse engineering and functionally identical reproduction of obsolete integrated circuits, modules or assemblies as hybrids
  • Proprietary products like precision OCXOs or high performance amplifiers
Assembly/Technology
  • Thinfilm technology on ceramics, glass or sapphire
  • Thickfilm technology
  • Thin- and thick-wire bonding
  • Quality Control to MIL-STD-883
Packaging
  • Packaging in hermetically sealed metal packages
  • TO standard cases, packages for power electronics etc.
  • Seam welding
  • Ringbulge welding
  • Ceramic packages
  • Design of customer specific packages
  • Verification by rough- and fineleak test
Test
  • Electrical test to customer specification (possible under temperature)
  • Characterization of semiconductors and hybrids
  • From MOSFET gate-source leakage current to RF noise figure measurement
Crystal Oscillators OCXO High Precision up to 80MHz, TTL & HCMOS type in various hermetically sealed packaging (TO-8, DIP, SMD), wide temperature range, low power consumption, MIL-STD screening.
High Performance Amplifiers & Analog Switches Amplifiers with High Performance for applications of High Voltage, Low Noise, Precision, Instrumentation, High Frequency and Customer Specific. Over Temperature protection and alarm. Designed to comply with MIL-STDs. High Voltage Analog Switches with high continuous current, fast switching with low On-Resistance, NC/NO configurable and rugged. Suitable for Sonar, Piezo, MEMS, Test Equipment and Power Supplies. Designed to comply with MIL-PRF-38534 / MIL-STD 883C/D/E  
Active Filters Custom-specific active filters in hybrid technology, digital or analog RC-network or Switched Capacitor types. Nearly all transfer functions of sixth order can be configured such as Bessel-, Chebyshev- or Butterworth frequency response, as well as characteristics with two zeros like Cauer or inverse Chebysheff. The filter can of course also be used to realize transfer functions of second or fourth order.
Optoelectronics CCD- and CMOS-Sensors:
  • Focal plane design & assembly
  • Focal plane signal conditioning circuitry design & assembly
  • Focal plane testing
  • Focal plane repair (replacement and repositioning of sensors)
  • Complete camera and camera head design, assembly and testing
Modules/Components:
  • Laser modules (design, assembly & packaging)
  • IR-emitters/sensors (customized mounting & packaging)
  • Customer specific display modules and visible light emitters
  • Assistance in research projects by our innovative tea


14 Bar Kochva St., Bney Berak 51261, Israel    Tel : +972-3-5705323    Fax : +972-3-5705331    info@brunocorp.co.il